HERMETIC PACKAGES AND FEEDTHROUGHS FOR NEURAL PROSTHESES NIH GUIDE, Volume 23, Number 1, January 7, 1994 RFP AVAILABLE: NIH-NINDS-94-03 P.T. 34 Keywords: 0740027 Prosthetic Device, Neural BIOMEDICAL ENGINEERING National Institute of Neurological Disorders and Stroke The Neural Prosthesis Program of the National Institute of Neurological Disorders and Stroke (NINDS) is seeking a contract to develop and demonstrate the reliability of implantable, microsized, hermetic packages and feedthroughs. The micropackage is required to permit neural prostheses that utilize integrated circuits and discrete components such as microcoils and capacitors to be chronically implanted. Electrical feedthroughs from inside the package to the biological side of the package are required. These must be compatible with high density connections to both conventional microelectrodes and thin-film microelectrodes or potentially to electrodes that are integrated as part of the micropackage. The package must be biocompatible and must protect the implanted electronics from the biological environment for periods of up to 40 years. The package should be transparent to light and radio frequency electromagnetic waves to permit power and telemetry signals to be received within the package. Personnel with established expertise in microfabrication, hermetic packaging, and biomedical engineering are needed. It is anticipated that one award will be made for a period of three years in September 1994. This is not a Request for Proposals (RFP). The RFP was issued on December 30, 1993 and proposals are due on February 28, 1994. All responsible sources shall be considered by the agency. INQUIRIES To receive a copy of the RFP, submit a written request and supply two self-addressed mailing labels, to: Contracting Officer Contracts Management Branch National Institute of Neurological Disorders and Stroke Federal Building, Room 901 7550 Wisconsin Avenue Bethesda, MD 20892 ATTN: RFP NIH-NINDS-94-03 .
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